The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
NEC Develops High-Efficiency, Compact Power Amplifier Module for 5G Base Station Radio Units
January 28, 2026 | JCN NewswireEstimated reading time: 1 minute
NEC Corporation announced the development of a high-efficiency, compact Power Amplifier Module (PAM) for the sub-6GHz band, designed for integration into 5G base station Radio Units (RUs).
PAMs are electronic components that amplify signals for long-distance radio transmission, and their power consumption accounts for approximately 75% of the total power consumed by an RU. By integrating this high-efficiency PAM into RUs, NEC aims to reduce device power consumption and size, thereby contributing to overall power savings in 5G networks and reduced operational costs for telecommunication carriers.
NEC plans to incorporate this PAM into new RUs scheduled for release in the first half of fiscal year 2026 and also envisions a global deployment of the PAM as a standalone product, including its application in base stations from other manufacturers.
This PAM achieves both high efficiency and compactness, which has been challenging until now, by integrating NEC's strengths in high-efficiency circuit design technology using Gallium Nitride (GaN) devices, high-density mounting technology, and simulation expertise related to load modulation methods. Specifically, it achieves a high Power-Added Efficiency (PAE) of 50%, indicating the proportion of supplied DC power that can be used for amplifying radio signals. This results in a 10% reduction in power consumption compared to conventional PAMs (*3). Furthermore, it boasts a compact form factor of 10mm x 6mm.
Since 5G networks utilize higher frequency bands compared to 4G, the coverage area of a single RU is relatively narrower. Therefore, to ensure comprehensive coverage across wide areas and even behind buildings, more RUs need to be deployed. By integrating this PAM into RUs, NEC aims to reduce the power consumption of individual RUs, contributing to overall power savings in 5G networks and lowering operational costs for telecommunication carriers.
NEC will showcase this PAM at "MWC Barcelona 2026 (MWC2026)," the world's largest mobile-related exhibition, scheduled from March 2 to 5, 2026. At the venue, NEC will highlight the PAM's features, high-efficiency operation, energy-saving effects, and increased design flexibility for equipment.
Going forward, NEC will continue to provide technologies that balance energy efficiency and high performance to realize sustainable network infrastructure.
Some of the technologies used in the new device were obtained from a grant program (JPJ012368G50801) by the National Institute of Information and Communications Technology (NICT), Japan.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Infineon Technology Demonstrates Proven Reliability in Space on Artemis II Mission
04/21/2026 | InfineonNASA's Artemis II mission has successfully returned to Earth after ten days in space, having approached the Moon and reached the farthest distance from our planet ever achieved by crewed spaceflight.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Global AI Optical Transceiver Market to Reach US$26 Billion in 2026
04/20/2026 | TrendForceTrendForce’s latest research indicates that the global market for AI-focused optical transceivers has entered a phase of rapid growth, with market size projected to expand from US$16.5 billion in 2025 to $26 billion in 2026, representing over 57% YoY growth.
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.