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AdvancedPCB Expands HDI Inspection Capabilities at Orange County Facility
January 30, 2026 | AdvancedPCBEstimated reading time: 1 minute
AdvancedPCB, a leading U.S. printed circuit board manufacturer, installed a new Galaxy 25µ CIMS automated optical inspection (AOI) system at its Orange County facility, strengthening inspection performance for HDI and advanced multilayer PCB production and providing customers with greater confidence as designs move through manufacturing.
The Galaxy 25µ AOI system supports inspection of fine line and space technology down to 25 microns (1 mil) and is designed for high-volume, high-density PCB production. For AdvancedPCB customers, this means improved detection of subtle defects that can impact yield, reliability, and downstream assembly, particularly on dense, high-layer-count designs.
The system’s advanced optics and image processing improve contrast and registration accuracy, allowing inspection to adapt more effectively to panel variations. This enables AdvancedPCB to maintain tight inspection standards without slowing production, helping customers stay on schedule even as design complexity increases. With inspection throughput of up to 260 sides per hour, the Galaxy 25µ also adds capacity to support high-mix programs and fast-turn requirements.
“This investment reflects our ongoing commitment to strengthening all aspects of our operation, from the people we develop, to the processes we refine, to the equipment we deploy on the factory floor,” said Greg Halvorson, Chief Executive Officer at AdvancedPCB. “Advanced inspection capability like the Galaxy 25µ ensures our teams have the tools they need to support increasingly complex customer designs with consistency, speed, and confidence.”
AdvancedPCB manufactures rigid, rigid-flex, flex, and HDI printed circuit boards in the United States, supporting aerospace, defense, data centers, medical technologies, robotics, and a wide range of industrial markets. The company applies 40 years of PCB manufacturing expertise, front-end engineering support, and disciplined process control to produce high-reliability circuit boards with proven quality from prototype through production.
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Nordson Test & Inspection Partners with Quiptech Mexico to Expand Market Presence
05/05/2026 | Nordson Test & InspectionNordson Test & Inspection, a global leader in test, inspection and metrology solutions for semiconductor and SMT markets, announced a strategic partnership with Quiptech Mexico (a trading name of QTEK Mexico).
JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
04/28/2026 | JAVAD EMSJAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.
TRI Launches New Wafer Inspection and Metrology Platform
04/28/2026 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
Controlar Introduces PicAI to Strengthen Probe Inspection in Electronics Manufacturing
04/16/2026 | ControlarControlar is bringing a new level of precision and control to electronics testing with the launch of PicAI (AI-Driven Probe Inspection Control), a fully automated system designed to replace manual ICT fixture verification in high-reliability environments.