Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Cadence, TSMC Collaborate on Certified Tools and Silicon-Proven UALink IP

09/25/2026 | Cadence Design Systems
Cadence announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers.

CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028

09/18/2026 | TrendForce
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging.

Zuken Joins TSMC’s Open Innovation Platform® EDA Alliance

07/08/2026 | Zuken
Zuken Inc. announced that it has joined the EDA Alliance in TSMC’s Open Innovation Platform® (OIP).

Siemens Collaborates with TSMC to Advance AI for Semiconductor Design

04/22/2026 | Siemens
Siemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.

CEA-Leti, CEA-List & PSMC Integrate RISC-V and MicroLED Silicon Photonics for 3D AI Systems

04/03/2026 | CEA-List
CEA-Leti, a world-leading micro & nanotechnologies research institute, and CEA-List, a specialist in smart digital systems, announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in