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February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

02/11/2026 | I-Connect007 Editorial Team
I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

PEDC: Built for the Design Community by the Design Community

02/05/2026 | Peter Tranitz, Global Electronics Association
The Pan-European Electronics Design Conference (PEDC) was developed to provide Europe’s electronics design community with a non-commercial, Pan-European, technologically advanced forum. PEDC 2026 delivered exactly that. This second edition of the conference brought together 130 participants from 23 countries across Europe and beyond for two days of technical exchange, discussion, and connection. Hosted by the Global Electronics Association and Fachverband Elektroniksdesign und-fertigung e.V. (F.E.D)., and supported by Altium, Siemens, and Zuken, the event featured three technical tracks, 36 presentations, three keynotes, and a group of exhibitors.

Nolan’s Notes: Five Key Changes to APEX EXPO

02/05/2026 | Nolan Johnson -- Column: Nolan's Notes
This month, we devote our issue of SMT007 Magazine to previewing the upcoming APEX EXPO, March 16–20, in Anaheim, California. APEX EXPO stays in Anaheim until 2029, so, geographically, things are stable, but topically, changes are afoot. Here are five ways the trade show is changing for the better this year.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/30/2026 | Marcy LaRont, I-Connect007
It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.

Unlock Breakthrough Electronics Innovation at the APEX EXPO 2026 Technical Conference

01/28/2026 | Global Electronics Association
Electronics engineers, technologists, and industry leaders have a strategic advantage at this year’s Advanced Electronic Packaging Conference 2026, the premier technical conference at APEX EXPO 2026, where 80+ original technical papers, cutting-edge insights, and peer-reviewed research converge to accelerate product performance, solve manufacturing challenges, and drive competitive differentiation.
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