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Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin

07/23/2026 | Kurtz Ersa
Kurtz Ersa Inc., a leading supplier of electronics production equipment, has entered into a new representative agreement with E-tronix to support customers in Illinois and Wisconsin. Under the agreement, E-tronix will provide sales support for Kurtz Ersa’s soldering, reflow, and rework equipment across the region.

Mycronic's Setup Optimization Genetics

07/23/2026 | Nolan Johnson, SMT007 Magazine
At Mycronic, Robert Helleday, head of R&D, and Göran Frank, head of Product Management, are quick to clarify that setup optimization is “in our DNA at Mycronic.” That’s important because, in electronics manufacturing, every minute of machine downtime directly impacts productivity, profitability, and responsiveness to customer demand. As product lifecycles shorten and high-mix, low-volume production becomes the norm, manufacturers are under increasing pressure to reduce setup times, accelerate changeovers, and improve material flow without sacrificing quality or traceability.

Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation

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Keysight Technologies, Inc. announced that it completed the acquisition of VPIphotonics on June 9, 2026, adding system-level simulation to its photonic design automation portfolio and enabling optical and electrical engineers to advance designs from component to complete link within a single environment.

Common vs. Differential Mode in Routing and Signal Integrity

06/11/2026 | Kristin Moyer, Sacramento State University and Global Electronics Association
In high-speed designs, the distinction between common-mode and differential-mode is becoming increasingly critical in PCB routing. While most designers are familiar with differential routing as a technique for certain signals on the PCB, many may not realize its underlying purpose. Differential routing is used to mitigate differential mode noise in the system. To understand this, we need a bit of electrical engineering background on signal and current flow in a system.

Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4

06/04/2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?
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