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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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When Does Reducing Silver Make Sense?

10/27/2026 | Senthil Kanagavel, MacDermid Alpha Electronics Solutions
There is a single decision at the center of every die-attach conversation right now that isn’t as much about chemistry as it is about control. This is most evident because silver prices have experienced significant volatility, evolving PFAS requirements are increasing regulatory and customer scrutiny, qualification windows are shrinking, and the packages that support AI, automotive, and power infrastructure must meet demanding performance and reliability requirements.

STMicroelectronics Simplifies Matter Device Authentication with MatterConnect

10/23/2026 | STMicroelectronics
STMicroelectronics has launched the ST MatterConnect service for securely loading authentication credentials into secure chips used in Matter-compatible smart-home devices.

Mycronic Appoints Mikael Wahlsten as SVP of Pattern Generators

10/21/2026 | Mycronic AB
Mycronic AB has appointed Mikael Wahlsten as Senior Vice President Pattern Generators and a member of Mycronic’s Executive Management team, effective November 1, 2026.

onsemi, Sungrow Advance Energy Storage with SiC Technology

10/19/2026 | onsemi
onsemi announced that Sungrow, a global leader in renewable energy technology, has adopted onsemi’s latest EliteSiC silicon carbide (SiC) hybrid power module technology for the Sungrow PowerTitan 3.0 energy storage platform.

Siemens Advances AI Chip Lithography with NVIDIA cuLitho

10/15/2026 | Siemens
Siemens announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows.
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