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DFM Mistakes Designers Make When Moving to ELIC

07/20/2026 | Anaya Vardya, American Standard Circuits
The transition from HDI to every layer interconnect (ELIC) is where the DFM gap between design intent and fabrication reality is most visible. Several common misconceptions appear consistently in the data packages we review at ASC. The most common ELIC design mistake mirrors what we generally see in first-time UHDI builds: using process minimums everywhere because they appear on a capability chart. In ELIC, this is especially consequential. If only one region truly requires aggressive geometry, say, a fine-pitch BGA escape, the rest of the design should preserve margin. Relaxing non-critical areas makes the overall build more manufacturable without sacrificing the dense region that drives the stackup.

The AI Data Center Boom: Technology, Capacity, and Society

07/17/2026 | Marcy LaRont, I-Connect007
AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.

Marcy’s Musings: From Business Diversification to Designing Display Electronics

07/16/2026 | Marcy LaRont -- Column: Marcy's Musings
I love this time of year. Aside from summer, I appreciate the natural pause from the busyness of trade shows, conferences, airport delays, and back-to-back Teams meetings. Colleagues become a bit harder to reach as family vacations are prioritized, and we take focus off work for a little while. But no matter the season, the accelerated pace of technological advancement doesn’t actually slow down. In this issue, we use this pause to look inward and forward.

Ionic Contamination Debate Highlights Growing Divide in Automotive Electronics

07/15/2026 | I-Connect007 Editorial Team
A recent Global Electronics Association panel discussion revealed both broad agreement and sharp differences regarding one of electronics manufacturing’s most persistent reliability questions: How clean is clean enough? The discussion, focused on ionic contamination assessment in electronic control unit (ECU) manufacturing, brought together the following experts:  Tim Dietz from Ford Motor Company, Dr. Lothar Henneken from Robert Bosch, Eric Camden from Foresite, Hubertus Mertens from MKS’ Atotech, Doug Pauls from It Depends Electronics, and Stan Rak from SF Rak Company, as moderator. While everyone agreed that contamination control is essential for long-term reliability, panelists differed significantly on whether ion chromatography (IC) should play a larger role in production acceptance and process control.

Global Sourcing Spotlight: Making Global Sourcing Simple Again

07/15/2026 | Bob Duke -- Column: Global Sourcing Spotlight
If you’ve been in global sourcing long enough, you know the feeling of dashboards everywhere, endless reports, overlapping supplier databases, and “urgent” alerts that all say something different. What used to be a straightforward process of finding, qualifying, and managing suppliers has become a maze of tools, metrics, and meetings. Somewhere along the way, complexity became the norm.
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