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PCB Design in 2026 and Beyond

02/12/2026 | Filbert Arzola, Raytheon
We asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.

Latest SMT007 Magazine Previews APEX EXPO 2026: Bigger and Better Than Ever

02/04/2026 | I-Connect007 Editorial Team
APEX EXPO 2026 is coming soon, and it is bigger and better than ever. In the February issue of SMT007 Magazine, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year. Consider this your passport to where the electronics manufacturing industry is headed in 2026.

What's Next in PCB Fabrication?

02/03/2026 | Marcy LaRont, I-Connect007 Magazine
If you have been in the PCB business for any length of time, you either know Gene Weiner or know of him. With a career spanning more than six decades, he has been an active member of the Global Electronics Association (formerly IPC) since the early 1960s and was inducted into the  Raymond E. Pritchard Hall of Fame in 2005 in recognition of his lifelong impact on the industry. Having presented hundreds of technical and management papers, he remains a sought-after speaker in the HDI and UHDI space, most recently being recognized at the TPCA conference in Taiwan.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/30/2026 | Marcy LaRont, I-Connect007
It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.

Elementary Mr. Watson: Where the PCB Ends and Advanced Packaging Begins

01/29/2026 | John Watson -- Column: Elementary, Mr. Watson
Change sits at the center of almost everything in PCB design. From the earliest days of printed circuits to today’s highly integrated electronic systems, stability does not define this discipline; evolution does. Materials change, component geometries shrink, signal speeds increase, and manufacturing processes advance. With each shift, we reshape the role of the PCB designer, sometimes quietly, and other times in a way that feels like a freight train driving through your living room.
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