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SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem

05/06/2026 | SEMI
Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.

Sharp Increase in Global Semiconductor Sales in Q1 2026

05/05/2026 | ESIA
The European Semiconductor Industry Association (ESIA) reports that, in the first quarter of 2026, the global semiconductor market recorded a sharp increase of 79.2% year-on-year, reaching USD 298.55 billion in sales.

Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware

05/05/2026 | PRNewswire
Xanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.

U.S. Semiconductor Industry Convenes at Glass4Chips Summit

05/04/2026 | NY CREATES
The 2026 Glass4Chips Summit will bring together leaders and innovators across industry, academia, and government to address a framework for accelerating the adoption of glass substrates in next-generation semiconductor manufacturing and packaging.

Navitas Semiconductor Appoints Davin Lee as Independent Director to its Board

05/04/2026 | Globe Newswire
Navitas Semiconductor,, an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, announced the appointment of semiconductor veteran, Davin Lee, to its Board effective immediately.
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