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IC Substrates vs. UHDI: The Future of Interconnect

03/15/2026 | Marcy LaRont, I-Connect007
Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.

The Power of Apprenticeship: Connecting Talent, Training, and Opportunity

03/10/2026 | Marcy LaRont, I-Connect007
The lack of a skilled workforce looms large over the electronics manufacturing industry, but the Global Electronics Association is building a powerful solution through an apprenticeship program that has evolved into a nationally recognized, well-funded workforce engine. Cory Blaylock and Vicki Hawkins are cutting through red tape with the U.S. Department of Labor (DOL) to access millions of dollars in funding, and their collaboration with industry companies, creative problem solving, and commitment to success is helping address this great challenge and shape the next-gen electronics workforce.

East Asia at APEX EXPO 2026: Focusing on Cross-regional Exchange and Industry Connectivity

03/03/2026 | Sydney Xiao, Global Electronics Association East Asia
At APEX EXPO 2026, the Global Electronics Association East Asia team will promote engagement with global experts, industry partners, and member companies by participating in technical committee meetings and industry forums, and by organizing networking dinners and exhibitor visits. More than 40 companies from East Asia are expected to exhibit at this year’s show, representing Mainland China, Taiwan Region, Japan, and Korea.

Keysight and Ericsson Collaborate to Enable Pre-6G Interoperability Validation

02/26/2026 | BUSINESS WIRE
Keysight Technologies, Inc. and Ericsson have collaborated to troubleshoot and validate interoperability between an Ericsson pre-6G base station (gNB) and prototype pre-6G devices, using Keysight’s WaveJudge Wireless Analyzer Solutions.

Technology Pavilion Debuts at APEX EXPO 2026

02/26/2026 | Global Electronics Association
Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.
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