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Simon Khesin - Schmoll Maschinen

Suggested Items

Driving Innovation: Selecting the Right Laser Source

04/28/2026 | Simon Khesin -- Column: Driving Innovation
When I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.

CIL Joins EU Project OSYRYS to Bring Hybrid-electric for Regional Flight Closer to Reality

03/24/2026 | CIL
What if the future of regional flight was hybrid-electric—and closer than you think? CIL joins a diverse group of 24 EU industrial, research, and academic partners to make it reality.

DigiKey Collaborates with STMicroelectronics and Ultra Librarian to Deliver Enhanced eDesignSuite Integration

03/20/2026 | PRNewswire
DigiKey, the global distribution leader of electronic components and automation products, announces the availability of an enhanced eDesignSuite experience, developed through a collaboration with STMicroelectronics (ST) and Ultra Librarian.

STMicroelectronics Advances Ultra-Wideband for Automotive and Smart Devices

03/13/2026 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an ultra-wideband (UWB) chip family that comprehensively supports the next-generation wireless standard for localizing and tracking devices at distances up to several hundred meters.

IC Substrates vs. UHDI: The Future of Interconnect

03/15/2026 | Marcy LaRont, I-Connect007
Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.
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