Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

EIPC Winter Conference Review: A Focus on Miniaturization

02/12/2026 | Pete Starkey, I-Connect007
The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.

What's Next in PCB Fabrication?

02/03/2026 | Marcy LaRont, I-Connect007 Magazine
If you have been in the PCB business for any length of time, you either know Gene Weiner or know of him. With a career spanning more than six decades, he has been an active member of the Global Electronics Association (formerly IPC) since the early 1960s and was inducted into the  Raymond E. Pritchard Hall of Fame in 2005 in recognition of his lifelong impact on the industry. Having presented hundreds of technical and management papers, he remains a sought-after speaker in the HDI and UHDI space, most recently being recognized at the TPCA conference in Taiwan.

Happy’s Tech Talk #45: Designing the Smart Factory 

01/15/2026 | Happy Holden -- Column: Happy’s Tech Talk
Automation and computers have been my passion for the last 55 years, even when I was a student. The methodologies that have served me over the years in automating electronics manufacturing include highlights from several free resources with important characteristics of the smart factory.

Happy New Year from the I-Connect007 Staff

12/31/2025 | Michelle Te, I-Connect007
The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.

Inside the Fight for U.S. Advanced Packaging: Military Electronics Experts Weigh In

12/15/2025 | I-Connect007 Editorial Team
Modern warfare—driven by rapid evolution of UAVs, autonomous systems, and high-speed sensing—has made it clear that U.S. defense electronics must move beyond legacy architectures and embrace UHDI, advanced substrates, and next-generation interconnect technologies. In this roundtable discussion, two defense electronics experts outline a central challenge: The U.S. cannot field high-performance systems or maintain technological advantage while relying on overseas PCB, substrate, and component supply chains.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in