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Cut Through the Noise: I-Connect007 Previews APEX EXPO 2026 With ‘The Top 5 Things You Need to Know About...’
February 18, 2026 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
As APEX EXPO 2026 approaches, I-Connect007 is unveiling an exclusive event coverage feature designed to highlight the technologies and processes that engineers and manufacturers are actively evaluating today.
Titled “The Top 5 Things You Need to Know About…,” this series appears in the February issues of SMT007 Magazine and I-Connect007 Magazine and brings together expert insight from leading companies across the electronics manufacturing ecosystem. Each contributor distills five essential takeaways within their area of expertise, giving readers a practical preview of the technologies, processes, and strategic conversations shaping this year’s APEX EXPO.
Here's an overview of what you’ll find:
Blackfox Training provides a focused look at manufacturing training and workforce development. It's overview of The Top 5 Things You Need to Know About Manufacturing Training emphasizes the importance of IPC certification, customized training programs, and continuous assessment to ensure employees retain critical knowledge, adapt to evolving technologies, and maintain consistent quality standards. They reinforce training as a long-term investment essential to both operational excellence and workforce retention.
Burkle North America addresses multilayer system solutions and the evolving demands of PCB manufacturing at scale. Burkle’s Top 5 Things You Need to Know About Multilayer System Solutions explores how integrated WorkCell concepts, high-volume lamination, real-time process monitoring, and Industry 4.0 capabilities are transforming production efficiency without compromising quality.
KYZEN brings attention to cleaning as a critical manufacturing process with its Top 5 Things You Need to Know About Cleaning. The overview walks readers through the most influential process variables, including chemistry selection, concentration, wash time, temperature, and mechanical energy, and explains how each directly impacts cleanliness, reliability, and yield. By framing cleaning as a balance of interdependent forces, KYZEN underscores how proper optimization can reduce costs and improve long-term process stability.
Remtec focuses on metallized ceramic circuits, outlining why these materials are gaining traction in high-power, high-reliability, and harsh-environment applications. The Top 5 Things You Need to Know About Metallized Ceramic Circuits highlights superior thermal conductivity, electrical isolation, CTE compatibility, and design versatility compared to traditional PCBs. It demonstrates how advanced ceramic technologies enable compact, durable packaging solutions for demanding industries such as aerospace, power electronics, medical, and RF applications.
Technica, U.S.A. rounds out the series with The Top 5 Things You Need to Know About Implementing Smart Automation Solutions, offering a practical perspective on what manufacturers should evaluate before and during automation initiatives. Technica’s overview addresses the importance of selecting experienced partners, defining short- and long-term automation goals, aligning investment with production needs, and preparing IT infrastructure for connected manufacturing.
“The Top 5 Things You Need to Know About…” delivers expert-driven insight into the topics that matter most heading into APEX EXPO 2026. Explore the full exclusive feature set in the February issues of SMT007 Magazine and I-Connect007 Magazine and learn more by visiting I-Connect007.com.
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EIPC Winter Conference Review: A Focus on Miniaturization
02/12/2026 | Pete Starkey, I-Connect007The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.
What's Next in PCB Fabrication?
02/03/2026 | Marcy LaRont, I-Connect007 MagazineIf you have been in the PCB business for any length of time, you either know Gene Weiner or know of him. With a career spanning more than six decades, he has been an active member of the Global Electronics Association (formerly IPC) since the early 1960s and was inducted into the Raymond E. Pritchard Hall of Fame in 2005 in recognition of his lifelong impact on the industry. Having presented hundreds of technical and management papers, he remains a sought-after speaker in the HDI and UHDI space, most recently being recognized at the TPCA conference in Taiwan.
Happy’s Tech Talk #45: Designing the Smart Factory
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Happy New Year from the I-Connect007 Staff
12/31/2025 | Michelle Te, I-Connect007The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.
Inside the Fight for U.S. Advanced Packaging: Military Electronics Experts Weigh In
12/15/2025 | I-Connect007 Editorial TeamModern warfare—driven by rapid evolution of UAVs, autonomous systems, and high-speed sensing—has made it clear that U.S. defense electronics must move beyond legacy architectures and embrace UHDI, advanced substrates, and next-generation interconnect technologies. In this roundtable discussion, two defense electronics experts outline a central challenge: The U.S. cannot field high-performance systems or maintain technological advantage while relying on overseas PCB, substrate, and component supply chains.