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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Merlin Flex Continues to Invest in Long Flex

09/24/2026 | Merlin Flex Ltd
Merlin Flex Ltd has continued its investment into the manufacture of its long flex capability with a new oil-heated vacuum lamination press with a bonding area of 1800mm by 750mm.

WELLER Highlights IPC Class and CTI for Reliable PCB Manufacturing

09/24/2026 | ACCESSWIRE
WELLER PCB is highlighting the importance of defining IPC manufacturing class and PCB laminate requirements before a project enters production, especially for industrial, high-voltage and reliability-sensitive electronics.

Lam Research Breaks Ground on Oregon Lab for AI Semiconductor R&D

08/27/2026 | PRNewswire
In a ceremony at its world-class research and development (R&D) center in Tualatin, Oregon, Lam Research Corp. commemorated the start of construction on its new, state-of-the-art Oregon lab, part of a more than $3 billion planned investment in its global lab network over the next five years to accelerate breakthroughs for the creation of advanced AI chips.

Lam Research to Invest $3B+ to Expand Global Labs for AI Era

08/18/2026 | Lam Research
Lam Research Corp. announced that it intends to invest more than $3 billion over the next five years to expand its global research and development (R&D) lab network.

High-Frequency High-Speed CCL Market to Reach $3.1B by 2035

08/13/2026 | Globe Newswire
The global high frequency high speed copper clad laminate market was valued at $4.5 billion in 2025 and is estimated to grow at a CAGR of 10.3% to reach $11.8 billion by 2035.
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