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Advanced Electronics Packaging Digest Expands Its Reach With New Substack Presence
February 23, 2026 | I-Connect007Estimated reading time: 1 minute
Existing subscribers will continue to receive the newsletter directly in their inbox
Advanced Electronics Packaging Digest (AEPD), the monthly newsletter focused on advanced electronic packaging technologies and trends, is expanding how readers can engage with its content. The newsletter is now available on Substack.
Substack provides an additional opportunity for engineers, designers, and industry professionals to follow AEPD while maintaining their newsletter’s existing email delivery. Current subscribers will continue to receive AEPD in their inboxes as usual, with no action required.
The Substack platform will serve as a central hub for AEPD, giving readers access to archived issues, an easy way to follow and share the publication, and a new discovery channel for professionals across the global electronics ecosystem. The expansion also helps introduce AEPD to new audiences interested in advanced packaging, heterogeneous integration, substrates, materials, and emerging manufacturing strategies.
“AEPD has seen strong, steady growth since its launch, and this expansion reflects how today’s technical audiences prefer to discover and follow content,” said Marcy LaRont, Executive Director of I-Connect007. “By adding Substack, we’re giving readers more flexibility without changing how they already receive the newsletter.”
Existing subscribers who prefer to follow AEPD on Substack can do so alongside email delivery, while new readers can subscribe through the platform and receive the same expert-driven insights while easily referencing back issues.
To explore Advanced Electronics Packaging Digest on Substack, visit and subscribe at iconnect007.substack.com.
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