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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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DATA MODUL Expands EMS with Integrated Assembly and Supply Chain Services
February 24, 2026 | DATA MODULEstimated reading time: 1 minute
DATA MODUL continues to expand its service portfolio in industrial product assembly. Customers benefit from customized manufacturing solutions offering a high degree of flexibility, quality and planning reliability.
Unlike traditional Electronic Manufacturing Services (EMS) providers, which primarily focus on electronic PCB assembly, we specialize in the assembly of complete units—ranging from display, touch and bonding components to fully functional sub-assemblies and end devices produced at its global manufacturing sites. As an EMS partner, we also take responsibility for end-to-end project execution, covering component sourcing, manufacturing and delivery.
Our assembly and logistics services include:
- Procurement of specified components through partner agreements and DATA MODUL’s global sourcing network
- Quality assurance for components, sub-assemblies and finished devices
- Coordination and documentation by experienced project teams
- Tailored logistics solutions with direct-to-destination delivery
- On-demand after-sales service, extending beyond project completion if required
By assuming responsibility for key processes, we significantly reduce interfaces and coordination efforts for its customers. The result is increased reliability, quality and transparency throughout the entire supply chain. In addition, DATA MODUL’s experienced R&D team supports the development process from design-in through to series production—acting as a trusted partner on the path to a fully assembled, market-ready product.
Technology and expertise for a wide range of requirements
With state-of-the-art manufacturing technologies, including bonding, prototyping, testing procedures and product qualification, DATA MODUL creates optimal conditions for the successful implementation of various projects. Whether low volumes during ramp-up phases or higher production volumes, manufacturing capacities are fully scalable and designed for maximum flexibility.
"We act as an extension of our partners, providing flexibility, expertise and practical solutions. Customers increasingly expect holistic, end-to-end services that reduce complexity and allow them to focus on their core business,” says Dr. Florian Pesahl, CEO of DATA MODUL.
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Sweeney Ng - CEE PCBSuggested Items
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.