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Magnalytix, providing real-time reliability solutions for electronics manufacturing, is proud to announce that Dr. Mike Bixenman will co-present the professional development course “The Reliability of the Electronic Assembly and Components as a Function of Assembly Cleanliness” on Sunday, March 15 in Room 304-C of the Anaheim Convention Center as part of the 2026 APEX EXPO Technical Conference.
Bixenman will co-present the session with Adam Klett of KYZEN Corporation and Vladimir Sitko of PBT-Works. The course will provide attendees with an understanding of key complexity factors, including the risks of flux present on highly dense assemblies, signal integrity as conductor width and spacings reduce, key considerations when selecting an aqueous cleaning agent, the impact of component standoffs, how to balance performance, cost, and reliability when selecting the cleaning machine, and qualify the process for acceptable levels of flux and process residues per IPC J-STD-001, Section 8.
Precision, reliability, performance, and stringent levels of cleanliness represent major demands in the design and manufacture of Class 3 electronic assemblies, including those for AI Systems, defense technologies, in addition to automotive and medical devices. The density and number of interconnects in these assemblies result in higher levels of flux and process residues under the component termination.
Bixenman, Klett and Sitko will also highlight how climate, temperature, and airborne contaminants necessitate an insulating condition in assemblies, requiring process residues during assembly to be effectively cleaned. Each of these factors demands higher levels of cleanliness in finished assemblies and will be addressed during the course.
