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Indium Powers the Future with Advanced Materials Solutions at CIPS 2026
February 26, 2026 | Indium CorporationEstimated reading time: 1 minute
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at CIPS – International Conference on Integrated Power Electronics Systems, March 10-12, in Dresden, Germany.
Company products to be highlighted include the following:
- Formic Acid Soldering Technology (FAST) is an ideal reflow method for power device packaging. Product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering that is ideal for efficient manufacturing of next-generation power electronics.
- Durafuse® HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder.
- InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow-processing temperatures compared with SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. Its low-organic content composition affords short drying times for increased throughput and less volume reduction between wet and post-sintered deposits, reducing the paste amount required.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
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