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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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FabSpace AI Revolutionizes Procurement in Electronics Manufacturing with AI-Driven Platform
March 2, 2026 | FabSpace AIEstimated reading time: 1 minute
FabSpace AI, an innovative platform designed to streamline the procurement process for the electronics industry, announces the launch of its AI-powered solution that simplifies and accelerates the way Purchasing Managers (PMs), Design Engineers, and Electronics Manufacturing Services (EMS) collaborate and source components.
FabSpace AI integrates seamlessly with existing workflows, enabling Purchasing Managers to receive instant, competitive bids from pre-vetted EMS providers, compare quotes based on key factors such as cost, lead time, certifications, and past performance, and track project status in real-time—all within one platform.
Key Features of FabSpace AI Include:
- Instant, Cost-Effective Bids: Purchasing Managers can receive bids from multiple EMS providers in seconds, eliminating the need for manually gathering quotes and speeding up the procurement process.
- AI-Driven Quote Comparison: Simplifies bid evaluation by automatically comparing quotes based on cost, lead time, certifications, and performance history, allowing for more informed and timely sourcing decisions.
- Real-Time Project Tracking: Eliminates fragmented communication and provides real-time updates on project status, ensuring that both buyers and EMS providers are aligned throughout the process.
- High-Quality EMS Provider Selection: FabSpace AI helps Purchasing Managers select EMS partners based on credentials, certifications, and past project success, reducing procurement risks and ensuring high-quality outcomes.
"We designed FabSpace AI to solve the common challenges faced by Purchasing Managers and EMS providers," said Quadri, CEO of FabSpace AI. "Our platform enhances speed, reduces manual effort, and ensures that the entire procurement process is more transparent, secure, and data driven. We are excited to help companies in the electronics sector improve efficiency and lower costs."
FabSpace AI’s core marketplace allows Purchasing Managers to receive real-time RFQs (Requests for Quotes) from EMS providers, while EMS companies can submit competitive bids and track progress within the platform. This collaborative environment is set to drastically reduce delays, errors, and communication issues, ensuring a more efficient and cost-effective procurement process.
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Rachael Temple - AlltematedSuggested Items
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Scanfil Releases Second Sustainability Report: 2025 Progress and 2026 Ambitions
04/14/2026 | ScanfilScanfil has published its second sustainability report for 2025 in accordance with the Corporate Sustainability Reporting Directive (CSRD).