-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
SIA Statement on Chip Security Act
March 3, 2026 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from President and CEO John Neuffer opposing the Chip Security Act (S. 1705/H.R. 3447).
“SIA members are fully committed to complying with export controls, and we strongly oppose the illicit diversion and misuse of our chip technologies. While we understand policymakers’ interest in addressing this issue, we cannot support blanket mandates for new, untested, and potentially infeasible on-chip mechanisms, such as what is being proposed in the Chip Security Act. Rushing to legislate complex, costly, and unproven security features risks undermining global trust in American semiconductor technologies and efforts to promote the export of the American AI technology stack, eroding our global leadership and competitiveness.
“Our companies work closely with government agencies, law enforcement, and other relevant stakeholders to prevent and detect illegal diversion and misuse of our products. We stand ready to engage with Congress to explore approaches to effectively address these risks, and to ensure American semiconductor technologies lay at the foundation of the global AI ecosystem.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
FPGA AI Chip Market to Surpass $100M Shipments by 2031 Amid Rapid ASP Decline
05/07/2026 | JPRJon Peddie Research (JPR), the market research and consulting firm covering graphics, AI processors, and visual computing, released FPGAs in AI, a new market intelligence report analyzing the emerging class of field-programmable chips designed for AI inference at the edge and in the cloud, and for IoT.
SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem
05/06/2026 | SEMIGlobal experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.
Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware
05/05/2026 | PRNewswireXanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.
U.S. Semiconductor Industry Convenes at Glass4Chips Summit
05/04/2026 | NY CREATESThe 2026 Glass4Chips Summit will bring together leaders and innovators across industry, academia, and government to address a framework for accelerating the adoption of glass substrates in next-generation semiconductor manufacturing and packaging.