-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Real Time with... APEX EXPO 2026: IPC Certification Trends With Blackfox
March 4, 2026 | Real Time with... APEX EXPOEstimated reading time: Less than a minute
Jamie Noland of Blackfox Training discusses crucial trends in IPC certification. Noland highlights the demand for updated standards like IPC J-Standard 001 and WHMA A-620, especially within the aerospace sector. The conversation also addresses the importance of these certifications for demonstrating employee expertise and Blackfox's role in providing focused, effective training solutions.
Experts will be present in Blackfox's booth, #1717, to discuss more about training and certification.
Look for more interviews with industry experts leading up to APEX EXPO 2026, special show coverage after the event on the Real Time with... APEX EXPO 2026 website and in our new Show & Tell Newsletter, sent to your inbox on Fridays starting March 27.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Regional Electronics Growth and Initiatives with Gaurab Majumdar
04/14/2026 | Real Time with... APEX EXPONolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.
Boeing Delivers ViaSat-3 Flight 3 Spacecraft to Viasat
04/13/2026 | BoeingBoeing announced, delivery of the ViaSat-3 Flight 3 (VS-3 F3) spacecraft to Viasat. Built on Boeing’s high-power 702MP+ platform and integrated at Boeing’s El Segundo facility in California.
Technica USA and DCT Partnership Insights
04/10/2026 | Real Time with... APEX EXPOThis discussion features Jason Perry from Technica and David Bures from DCT Cleaning, highlighting Technica's expansion in PCB fabrication and assembly. DCT, a leader in cleaning solutions, emphasizes the renewed importance of cleaning in modern electronics due to miniaturization. Comprehensive offerings and an innovative approach to achieving optimal cleanliness is revealed.
Robot Density Surges in Europe, Asia, and Americas
04/08/2026 | International Federation of RoboticsEconomies worldwide are prioritising the integration of factory robots, as automation becomes a critical tool for boosting productivity. In the global automation race, the Western European countries reached a record 267 robots per 10,000 employees in the manufacturing industry 2024 – ahead of North America with 204 units and Asia with 131 units.
East Asia's Electronics Dominance and AI with Sydney Xiao
04/08/2026 | Real Time with... APEX EXPOSydney Xiao, Global Electronics Association – East Asia President emphasizes the region's dominance in electronics manufacturing, particularly with the rise of AI. The association focuses on standards, workforce, technology, and collaboration to help members navigate AI opportunities, highlighting new IC substrate standards and advanced packaging initiatives.