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Insulectro Technology Village to Feature 30 Powerchats at APEX EXPO in Booth 4237
March 4, 2026 | InsulectroEstimated reading time: 1 minute
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, will present its popular and successful 13.5-minute PowerChats™ during this year’s IPC APEX EXPO at the Anaheim Convention Center, March 17-19, 2026.
Its 1800 sq ft megabooth will be configured as a modern, sleek Technology Village providing networking opportunities with Insulectro's best-in-class suppliers and, of course on popular PowerChats™.
The Insulectro PowerChats™, presented every 30-minutes, provide details on new products, technologies, processes. and services offered by Insulectro and key suppliers EMC, Arlon, Qnity, Pacothane®, InduBond®, AIT (Ormet®), Electroninks, MicroMax®, FOCUSTECH™, SCAN LABS, and Kyocera.
A special PowerChat® will be presented by PCBAA Membership Chair John Vaughan, VP of Strategic Markets for Summit Interconnect. The session covers the critical topic:Future of PCB Industry Depends on Government Action. The session will be held at 2:00pm on Tuesday, March 17.
“We are pleased to continue our PowerChats™,” commented Ken Parent, Chief Operating Officer, “Our outstanding expert presenters have crafted short, 13.5-minute, info-packed learning sessions where attendees will learn the WHAT/WHY/HOW on critical topics. Bottom line? All you need to know in 13.5-minutes.
“New products and technologies can change the way a board is designed and fabricated. In our field testing, we often hear ‘We could have never made this board before’,” continued Parent. “We’re anxious to share what we’ve learned in very concise presentations inside our booth (Space 4237).”
Insulectro Chief Technology Officer Chris Hunrath agrees, “Our PowerChats™ have been enormously popular throughout the years. Often, it’s standing room only."
“That’s due to the intriguing topics we spotlight in our chats. This year is no exception. We have an incredible lineup of topics and presenters. You could spend the day with us every day of the show. So come and join us,” Hunrath enthused.
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Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
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Advanced Electronics Packaging at APEX EXPO with Matt Kelly
04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
AGC's Advanced PCB Material Solutions
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