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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026

05/01/2026 | Indium Corporation
As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.

Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction

04/20/2026 | Kuldip Johal, MKS' Atotech
The rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.

Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology

04/14/2026 | PRNewswire
Carbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.

Integrated Solutions for Board-level Reliability: A Smarter Path Forward

08/27/2025 | Alan Gardner, MacDermid Alpha Electronics Solutions
In today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.

Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers

04/11/2025 | Avnet
Design engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
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