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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Aeronix Launches First Picatinny CLIK Solution for Unmanned Payload Integration

10/08/2026 | PRNewswire
Aeronix is the first company to demonstrate a true end-to-end CLIK capability implemented to the standard.

Rewiring Medical Brain-Machine Communication With Flex PCBs

07/09/2026 | Anaya Vardya, American Standard Circuits
Flex and rigid-flex PCBs are shaping the future through a range of innovative applications, including neural interface arrays that redefine brain-machine communication in the medical field. For decades, scientists and engineers have dreamed of tapping into this electrochemical symphony, and flex PCBs are finally making that dream clinically viable.

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

06/04/2026 | Stanton Rak, SF Rak Company
EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026

05/01/2026 | Indium Corporation
As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.

Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction

04/20/2026 | Kuldip Johal, MKS' Atotech
The rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
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