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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Compal Highlights Sustainability Progress and 2050 Net-Zero Commitment

08/21/2026 | Compal Electronics Inc.
Compal Electronics has released its 2025 Sustainability Report, highlighting the Company’s progress and achievements in sustainability governance, climate action, green innovation, talent development, sustainable supply chain management, and social inclusion. In 2025, Compal continued to strengthen its ESG governance and low-carbon transition, taking concrete actions toward its 2050 net-zero goal.

Michael Robbins Named President and CEO of Semiconductor Industry Association

08/19/2026 | SIA
The Semiconductor Industry Association (SIA) announced Michael Robbins has been named SIA president and CEO and will assume the role on Oct. 1.

Soctera Raises $4M to Advance Thermal Solutions for Defense and Space

08/12/2026 | PRNewswire
Soctera, Incorporated has closed $4 million in seed funding backed by Anorak Ventures and Multiball Capital, with additional participation from 9Yards Capital, Mana Ventures, and Red Bear Ventures.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/31/2026 | Michelle Te, I-Connect007
When I first came to the electronics industry, I was coming from the outside. Over time, I learned that this is not an industry that can be understood from just one angle. What happens in design affects manufacturing. Material choices affect reliability. Supply chain decisions influence business strategy, and advances in technology create new challenges and opportunities throughout the entire ecosystem. That complexity is one of the things I appreciate most about covering this industry. Each week, I’m reminded that there is always another layer to explore.

North American EMS Shipments Rise 6.7% in June as Book-to-Bill Reaches 1.33

07/29/2026 | Global Electronics Association
The Global Electronics Association announced today the June 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.33.
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