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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Intel Foundry Uses ASML High NA EUV Technology in Intel 18A Production of Core Ultra Series 3 Processors

07/15/2026 | ASML
ASML Holding N.V. reported that Intel Foundry is using ASML’s High NA EUV technology on the Intel 18A process node to produce a subset of its Intel® Core™ Ultra Series 3 processors.

Qnity Expands EUV Portfolio for Advanced Node Manufacturing

02/16/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the expansion of its offerings for extreme ultraviolet (EUV) lithography with the introduction of the Eon™ EUV photoresist product family.

Myrias Optics, Pixelligent Announce Strategic Manufacturing Partnership

10/16/2025 | PRNewswire
Myrias Optics, a pioneering manufacturer of flat optics , and Pixelligent Technologies LLC, the leading manufacturer of high refractive index (RI) nanocomposites for next-gen electronics, announced that they have entered into a strategic manufacturing partnership.

TI DLP® Technology Delivers High-Precision Digital Lithography for Advanced Packaging

10/02/2025 | Texas Instruments
Texas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company’s highest resolution direct imaging solution to date.

DuPont/Qnity Innovators in Semiconductor Materials Named 2025 Heroes of Chemistry

06/10/2025 | DuPont
DuPont today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.
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