Qnity Invests $61.5M in Advanced Semiconductor R&D and Manufacturing Facility

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Qnity Electronics, Inc. announced the acquisition of a new facility in Taiwan, to accelerate capacity and support continued customer demand across the global semiconductor industry. The $61.5 million advanced semiconductor research and manufacturing facility marks a significant investment in Qnity’s growth to keep pace with customer demand.

The new facility will support the production of the most advanced chip manufacturing applications. The site will feature production areas, state-of-the-art clean rooms, warehousing infrastructure, research labs and dedicated office space designed to enable high-performance manufacturing at scale.

This site expands Qnity’s existing presence in the Hsinchu Science Park, and the new facility strengthens the company’s commitment to maintaining manufacturing sites near customers in key geographies. With a global footprint and a strategic local-for-local operating model, Qnity enables customers and partners to meet rising demand from AI, high-performance computing, and advanced connectivity.

“Growth in advanced-node manufacturing continues to accelerate, and our customers are scaling rapidly to support next-generation technologies,” said Jon Kemp, Chief Executive Officer at Qnity. “This investment expands our capacity to meet customer demand, enhances global supply chain resilience, and enables the innovation and performance our customers depend on.”

The global semiconductor industry is expecting to reach $1 trillion in revenues in the next few years, driven by the rapidly increasing demand for AI chips and data centers. Over the past three years, Qnity has added new capacity across its semiconductor businesses to keep pace with industry expansion. The investment to expand this capacity in Taiwan builds on that momentum while reinforcing the company’s long-term growth strategy.

By increasing production capabilities in proximity to key customers, Qnity is strengthening supply assurance, improving operational agility, and positioning itself to meet the evolving demands of next-generation chip manufacturing.

“This facility represents more than just additional capacity; it reflects our confidence in the industry’s trajectory and our commitment to ensure customer support across current and future growth cycles,” added Kemp. “We are building the infrastructure today to make tomorrow’s semiconductor innovations possible.”

The site is expected to begin operations in early 2027, with additional capabilities and research facilities in future development phases.