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AdvancedPCB Promotes Industry Veteran John Stine to Chief Technology Officer
March 9, 2026 | AdvancedPCBEstimated reading time: 1 minute
AdvancedPCB announced the promotion of John Stine to Chief Technology Officer (CTO). A widely respected figure in the PCB industry, Stine has nearly four decades of experience spanning design, materials, manufacturing, engineering, quality, sales, and assembly.
Stine most recently served as Executive Vice President of Aerospace & Defense Strategic Business Development. Since joining AdvancedPCB, he has played a key role in advancing the company’s technical capabilities and supporting customers in some of the industry’s most demanding sectors. Prior to hat role, Stine served as Vice President of Operations at APCT, where he helped guide operational strategy and performance.
In his new role as CTO, Stine will lead AdvancedPCB’s technology strategy and guide the company’s continued investment in advanced manufacturing capabilities. He will work closely with engineering and operations teams to strengthen technical infrastructure, expand capabilities, and support the company’s rapid growth across aerospace, defense, AI/data centers, medical, and other high-reliability markets.
“John’s journey with us has been nothing short of remarkable,” said Greg Halvorson, CEO of AdvancedPCB. “Over the years, he has demonstrated exceptional leadership, technical expertise, and a relentless commitment to driving innovation. His contributions have been instrumental in advancing our products and shaping the direction of our technology.”
“I’m honored to take on the role of Chief Technology Officer at a time when our customers are facing increasing technical complexity and faster development cycles," said John Stine, Chief Technology Officer for AdvancedPCB. "My focus is on strengthening the technical partnership with our customers so we can solve harder problems, accelerate development cycles, and deliver reliable PCB solutions for their most demanding applications.”
Stine is Lean Six Sigma certified and is recognized throughout the electronics manufacturing community for his extensive hands-on experience and practical approach to solving complex technical challenges.
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TTCI’s Sam Fortna Actively Participates in IPC 2-40 Committee to Advance PCB and PCBA Standards
03/27/2026 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is proud to highlight the active involvement of Sam Fortna, Test Engineering Lead and Trainer, in the IPC 2-40 Committee, which develops standards for printed circuit boards (PCB) and printed circuit board assemblies (PCBA).
Educational Highlights From the APEX EXPO 2026 Show Floor
03/27/2026 | Kimberly Kutnick, Global Electronics AssociationAPEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.
Datest Invites Engineers to Stop Fighting AXI False Calls
03/25/2026 | DatestOn Tuesday, April 14 at 10:00 AM PT, Datest will host a technical webinar presented by Jesper Lykke, chief executive officer of Viscom, exploring how modern AXI systems are finally getting smarter about what they flag, and what they don’t.
Balanced Approach Needed to Regulate PFAS in Electronics
03/25/2026 | Diana Radovan, Global Electronics AssociationThe very broad per- and polyfluoroalkyl substances (PFAS) group has widespread use in both consumer and highly specialized applications, including, perhaps surprisingly, green technologies. Among these, the fluoropolymers subgroup plays a complex and critical role in electronics. To date, there are hardly any technically comparable alternatives. The electronics industry is facing a major regulatory and business challenge as inconsistent policies on potential PFAS restrictions in electronics are emerging across regions worldwide, and, in the U.S., in different states.
Driving Yield and Reliability: Indium to Present Advanced Semiconductor Packaging Solutions at CPCA 2026
03/20/2026 | Indium CorporationIndium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging processes at the International Electronic Circuit Exhibition (CPCA), taking place March 24-26 in Shanghai, China.