Ventec Showcases Glass Free Revolution and Launches Chiplam Portfolio at APEX EXPO 2026.

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Ventec International Group invites attendees of APEX EXPO 2026 to Booth 4642 to experience its Glass Free Revolution and the official launch of chiplam, a new high-performance materials portfolio for advanced semiconductor packaging and test applications.

As PCB and semiconductor technologies accelerate toward higher speeds, greater density, and increased thermal demands, Ventec is delivering innovative material solutions engineered for performance, precision, and reliability.

Leading the Glass Free Revolution

Ventec will showcase its pro-bond and thermal-bond RCF & RCC Bondply materials, designed to enable ultra-high-speed designs and applications requiring advanced thermal management.
These glass free solutions are ideal for:

• MLO interposers
• Probe cards
• Load boards
• U-HDI
• Embedded designs
• MiB
• Component packaging applications

Ventec’s pro-bond series marks a significant advancement in dielectric material technology, offering high-performance, glass free laminates engineered for the most demanding electronic & thermal management applications. 

This innovation is essential for high-speed and high-frequency designs in aerospace, automotive, and next-generation communication systems. 

By eliminating woven glass in thermal-bond, the thermal insulating effect of glass is removed from the dielectric, optimizing thermal performance and heat dissipation in MiB and embedded component multi-layer build up structures and component packaging applications.

By eliminating glass reinforcement, Ventec’s Glass Free materials enhance signal integrity, improve dimensional stability, and optimize thermal performance, empowering designers to overcome the
limitations of traditional laminate constructions.

Product Launch: chiplam High-Performance Materials Portfolio

Debuting at Booth 4642 during APEX EXPO 2026, chiplam is purpose-built to meet the evolving demands of advanced IC packaging and chip testing environments.
As semiconductor technologies push the boundaries of speed, density, and reliability, advanced packaging and test platforms require materials capable of performing under extreme conditions. chiplam delivers precision, stability, and long-term reliability where it matters most.

Designed for:

• Advanced IC packaging
• Burn-in boards (BiB)
• Probe cards
• Final test solutions

The chiplam Portfolio Includes:

• High-Tg and high-CTI laminates for burn-in and test boards
• Low-loss materials for high-speed and RF applications
• Thermally stable substrates for high-temperature burn-in environments
• Precision materials for probe card and fine-pitch testing applications
• Customized solutions tailored to specific packaging and reliability requirements

chiplam Delivers:

• Superior electrical performance
• Exceptional thermal stability
• Outstanding dimensional accuracy
• Long-term reliability under demanding test conditions

autolam & aerolam – High-Reliability Performance

Ventec will also highlight its autolam and aerolam material platforms — precision-engineered solutions tailored for demanding automotive and aerospace applications where durability, safety, and consistent performance are critical.

From ultra-high-speed computing and networking to semiconductor packaging and mission-critical automotive and aerospace systems, Ventec’s innovative materials portfolio is enabling the next generation of advanced electronic designs.

Visit Booth 4642 at APEX EXPO 2026.​​​​​​​​​​​​​​ The Ventec team looks forward to welcoming you!

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