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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Intel, Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era

07/27/2026 | Intel
Intel Corporation and Lens Technology announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging.

ESCATEC Expands Smart Manufacturing Capabilities with New Automated Line in Penang

07/27/2026 | ESCATEC
Global EMS provider ESCATEC has further strengthened its smart manufacturing capabilities with the installation of a highly automated assembly line at ESCATEC Electronics (EEM) in Penang.

Zhen Ding Strengthens Semiconductor Talent Development in Thailand

07/27/2026 | Zhen Ding
As part of its active global expansion and development of its Thailand manufacturing base, Zhen Ding Technology Group has been accelerating local industry-academia collaborations and talent cultivation alongside its investment in 2023 and official production in Q3 2025.

Mixx Technologies Acquires Sophic Silicon Technologies and Announces Manufacturing Collaboration with Kaynes Semicon

07/23/2026 | PR Newswire
Mixx Technologies, Inc., a US based venture-backed deep-tech company building the interconnect layer for hyperscale AI infrastructure, today announced two simultaneous strategic moves that together mark a defining moment in India's semiconductor journey.

EnerSys Refines Plans for Defense‑Focused Lithium Cell Manufacturing Facility with DOE Support

07/23/2026 | BUSINESS WIRE
EnerSys, a global leader in stored energy solutions for industrial, infrastructure, and defense applications, provided an update on its planned U.S. lithium cell manufacturing facility in Greenville,
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