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Companion Guide to Popular UHDI Podcast Series Now Available for Download
March 23, 2026 | I-Connect007Estimated reading time: Less than a minute
The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.
In this resource, the authors outline the key differences between HDI and UHDI, covering advanced via structures, copper-filled microvias, material innovations, and solder mask considerations. The guide explains how UHDI gives designers greater routing freedom while requiring stricter process discipline and earlier collaboration with fabricators. It goes on to explain why UHDI is ideal for RF, high-speed, aerospace, and miniaturized applications, delivering meaningful improvements in size, weight, power, reliability, and overall electronic performance.
Download the guide and listen to the podcast today!
All 12 episodes, as well as the companion guide, can be accessed here.
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