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Count On Tools Introduces Custom MYDATA MIDAS Tool for N61381US Component Placement
March 19, 2026 | Count On ToolsEstimated reading time: 1 minute
Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, has developed a custom MYDATA MIDAS tool (part # 2026-5652) designed to support the placement of the N61381US component in accordance with customer drawing specifications.
The tool features a 0.125” outside diameter (OD) and 0.047” inside diameter (ID) with a 90° V-cut profile, designed to meet the customer’s handling and placement requirements. It is pinned to D121 to maintain proper alignment and consistent positioning during pick-and-place operations.
The custom MIDAS tool was designed to improve stability and pickup accuracy when handling specialized or uniquely shaped components in automated SMT assembly. Its precision-machined geometry supports reliable vacuum performance, while the 90° V-cut helps seat and align the component during placement.
“With more than 35 years of experience designing and manufacturing custom pick-and-place tooling, our team works closely with customers to address specific placement challenges,” said Curt Couch, Vice President, Count On Tools. “This project is a good example of how we can quickly develop a solution tailored to a particular component and machine platform.”
Count On Tools designs and manufactures standard and custom nozzles, MIDAS tools, and component handling solutions for a wide range of SMT platforms, including MYDATA systems. The company supports applications ranging from micro-scale semiconductor devices to specialized connectors and other non-standard components used in electronics manufacturing.
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Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
Incap Group Reports Q1 2026 Revenue Growth and Completion of Lacon Acquisition
05/06/2026 | IncapIncap estimates that the company’s revenue and comparable EBITA in 2026 will be clearly higher than in 2025. The estimates include the impact of Lacon’s acquisition and are given provided that unexpected events impacting Incap’s business environment do not occur.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Electronics Manufacturing Needs Your Voice: Global Sentiment Survey Now Live
04/30/2026 | Global Electronics AssociationThe latest monthly Global Sentiment Survey from the Global Electronics Association is now open. At a time when demand uncertainty, policy shifts, energy costs, and supply chain recalibration are pulling the industry in multiple directions, the survey captures something macroeconomic data often misses: how manufacturers are actually experiencing conditions on the ground.