Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

Follow the Story: Building the Hardware Behind AI

09/24/2026 | Michelle Te, I-Connect007
When TTM opened its new UHDI facility in New York earlier this year, it wasn't simply adding another PCB factory. As the largest circuit board builder in the United States, TTM was investing in technologies that bring PCB fabrication closer to the complex world of semiconductor packaging. The advent of AI helps explain why that matters. The enormous compute power required by AI is pushing chip performance to new levels, but those chips don't operate in isolation.

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

SCHMID Secures EUR 37 Million Repeat Order for HDI-ML, mSAP Equipment

07/08/2026 | SCHMID Group
SCHMID Group has received a repeat order exceeding EUR 37 million from a leading Chinese customer for advanced HDI-ML and mSAP production equipment.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in