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Driving Yield and Reliability: Indium to Present Advanced Semiconductor Packaging Solutions at CPCA 2026
March 20, 2026 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging processes at the International Electronic Circuit Exhibition (CPCA), taking place March 24-26 in Shanghai, China.
The presentation, titled Co-innovation of Materials and Processes for Advanced Semiconductor Packaging, details how product innovations in several key ultra-low residue and no-clean flux and semiconductor pastes, including Indium Corporation's SiPaste®, can address unique manufacturing process challenges. Successful implementation of these applications requires close collaboration across the entire value chain to characterize material properties, optimize material-process interactions, and efficiently integrate material innovations into advanced packaging production processes.
Leo Hu is a senior area technical manager for East China and is based at Indium Corporation’s Suzhou facility. In this role, he manages the regional technical support team and partners with the company’s global organization to provide customer product and application solutions. Hu has more than 15 years of experience in semiconductor packaging, specializing in advanced assembly technology development, process improvement, and assembly materials applications.
CPCA 2026 visitors can attend Hu’s presentation on March 24, 1:30 p.m. China Standard Time (UTC+8).
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