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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Compal Makes Major Step into Space Communications, Joining the National Team
March 23, 2026 | Compal Electronics Inc.Estimated reading time: 2 minutes
Compal Electronics is actively participating in the "Pathfinder Communication Payload RF Module Prototype Development" project, initiated by the Taiwan Space Agency (TASA). Following the successful completion of the initial critical design phase, the project has now officially entered the prototype implementation and verification stage.
Leveraging its core expertise in multi-carrier array antenna technology, Compal is dedicated to developing key modules for CubeSat communication payloads. In alignment with national policies, the company is steadily laying the groundwork for Taiwan's sovereign communication satellite infrastructure.
Partnering with TASA to Establish a Model for Autonomous R&D
The Taiwan Space Agency (TASA) is collaborating with the domestic industrial sector to advance the B5G Low Earth Orbit (LEO) communication experimental satellite program. The initial phase aims to utilize CubeSat platforms to conduct preliminary verification of communication payload-related technologies. Compal Electronics is responsible for the RF transceiver and array architecture design and implementation of the Pathfinder communication payload prototype. This achievement not only demonstrates Compal’s autonomous R&D capabilities but also marks a significant milestone in the localization of Taiwan’s satellite supply chain.
Mr. JS Liang, Vice President of Compal’s Smart Device Business Group R&D Center, emphasized: "Compal will harness its deep-rooted expertise in wireless communication and Radio Frequency (RF) design to develop highly integrated satellite communication transceiver modules. Our goal is to create globally competitive, cost-effective, and autonomous communication payloads that provide a solid foundation for the national space industry."
From Design to System Integration: Building the Foundation for 6G Space Communications
As the 1B Pathfinder communication payload prototype enters the verification phase, Compal is accelerating the construction of a seamless communication matrix bridging Earth and space. This progress is not only a demonstration of technical prowess but also a profound commitment to the future of 6G space communication. By integrating full-spectrum capabilities—from design and verification to systemization—Compal aims to build a high-resilience, high-coverage foundation for next-generation communications, opening doors to the infinite possibilities of future LEO satellite applications.
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Foxconn Launches Second-Gen LEO Satellite, Begins Inter-Satellite Link Testing
05/05/2026 | FoxconnFoxconn Technology Group, the world's largest electronics manufacturing services provider, announced that its second-generation low-Earth orbit (LEO) satellites, "Pearl-1A" and "Pearl-1B," were successfully launched into their designated orbits via SpaceX's Falcon 9 rocket on the evening of May 3 (Taipei time).
AI Interconnect Boom Drives Southeast Asia Outsourcing Expansion
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