-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Compal Makes Major Step into Space Communications, Joining the National Team
March 23, 2026 | Compal Electronics Inc.Estimated reading time: 2 minutes
Compal Electronics is actively participating in the "Pathfinder Communication Payload RF Module Prototype Development" project, initiated by the Taiwan Space Agency (TASA). Following the successful completion of the initial critical design phase, the project has now officially entered the prototype implementation and verification stage.
Leveraging its core expertise in multi-carrier array antenna technology, Compal is dedicated to developing key modules for CubeSat communication payloads. In alignment with national policies, the company is steadily laying the groundwork for Taiwan's sovereign communication satellite infrastructure.
Partnering with TASA to Establish a Model for Autonomous R&D
The Taiwan Space Agency (TASA) is collaborating with the domestic industrial sector to advance the B5G Low Earth Orbit (LEO) communication experimental satellite program. The initial phase aims to utilize CubeSat platforms to conduct preliminary verification of communication payload-related technologies. Compal Electronics is responsible for the RF transceiver and array architecture design and implementation of the Pathfinder communication payload prototype. This achievement not only demonstrates Compal’s autonomous R&D capabilities but also marks a significant milestone in the localization of Taiwan’s satellite supply chain.
Mr. JS Liang, Vice President of Compal’s Smart Device Business Group R&D Center, emphasized: "Compal will harness its deep-rooted expertise in wireless communication and Radio Frequency (RF) design to develop highly integrated satellite communication transceiver modules. Our goal is to create globally competitive, cost-effective, and autonomous communication payloads that provide a solid foundation for the national space industry."
From Design to System Integration: Building the Foundation for 6G Space Communications
As the 1B Pathfinder communication payload prototype enters the verification phase, Compal is accelerating the construction of a seamless communication matrix bridging Earth and space. This progress is not only a demonstration of technical prowess but also a profound commitment to the future of 6G space communication. By integrating full-spectrum capabilities—from design and verification to systemization—Compal aims to build a high-resilience, high-coverage foundation for next-generation communications, opening doors to the infinite possibilities of future LEO satellite applications.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
HFR Accelerates GPU-Based AI-RAN Development with ETRI
05/11/2026 | PRNewswireHFR, Inc., a leading telecommunications equipment provider, announced that it has launched the full-scale development of 'AI-RAN,' widely considered the core technology for 6G.
Foxconn Launches Second-Gen LEO Satellite, Begins Inter-Satellite Link Testing
05/05/2026 | FoxconnFoxconn Technology Group, the world's largest electronics manufacturing services provider, announced that its second-generation low-Earth orbit (LEO) satellites, "Pearl-1A" and "Pearl-1B," were successfully launched into their designated orbits via SpaceX's Falcon 9 rocket on the evening of May 3 (Taipei time).
AI Interconnect Boom Drives Southeast Asia Outsourcing Expansion
05/05/2026 | TrendForceGlobal shipment volume of optical transceivers is projected to more than triple from 26.5 million units in 2023 to over 92 million units by 2026, according to TrendForce’s latest AI infrastructure research.
NEC to Supply Nine Types of Defense Equipment for Three Australian Frigates
04/30/2026 | JCN NewswireNEC Corporation has signed a contract with the Commonwealth of Australia to supply nine types of defense equipment that will be installed on all three ships in the initial phase of the Royal Australian Navy’s SEA3000 frigate procurement program, which involves the procurement of a total of 11 ships.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.