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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Lyntris Qualifies SPY-6 Radar Assembly for Naval Supply Chain

09/24/2026 | PRNewswire
Lyntris Inc., a defense technology company delivering sense-to-act connectivity solutions for the modern, connected battlespace, announced that it has completed qualification of a critical hardware assembly supporting Raytheon's SPY-6 family of radars.

Teradyne Introduces Iris 100 MicroLED Test System

09/21/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced Iris 100, a production-ready optical test platform for microLED devices.

Rewiring Medical Brain-Machine Communication With Flex PCBs

07/09/2026 | Anaya Vardya, American Standard Circuits
Flex and rigid-flex PCBs are shaping the future through a range of innovative applications, including neural interface arrays that redefine brain-machine communication in the medical field. For decades, scientists and engineers have dreamed of tapping into this electrochemical symphony, and flex PCBs are finally making that dream clinically viable.

IEEE Study Shows Thermal Scaling Analysis of Large Hybrid Laser Arrays for Co-Packaged Optics

07/22/2025 | PRNewswire
Multi-wavelength light sources are required for optical transceivers to increase data. However, scaling the laser array size increases thermal crosstalk, which may affect laser efficiency and reliability.

BEST Inc. Reports Record Demand for EZReball BGA Reballing Process

05/01/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
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