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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Indium to Present Advancements in Two Industry-Defining Solutions at ICEPT 2026

08/03/2026 | Indium Corporation
As a leading provider of high-reliability soldering and sintering materials for power electronics devices, Indium Corporation experts will share new research and insights on these two core industry product solutions at the International Conference on Electronics Packaging Technology (ICEPT) 2026, August 5-7, in Xi’an, China.

Extropic Signs $75M LOI with U.S. Commerce Department

08/03/2026 | PRNewswire
Extropic, the American company pioneering thermodynamic computing hardware, announced the signing of a letter of intent with the U.S. Department of Commerce for up to $75 million in funding through the CHIPS Research and Development Office (CRDO).

Siemens Launches SIMATIC AX WinCC Unified Elements

07/31/2026 | Siemens
Siemens—a global leader in industrial AI and automation technology—announced the launch of SIMATIC AX WinCC Unified Elements, an IT-like engineering application for the SIMATIC WinCC Unified system.

Qnity, University of Delaware Partner on Manufacturing Innovation

07/31/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced a strategic partnership with the University of Delaware College of Engineering (UD Engineering) designed to strengthen the engineering talent pipeline, expand research collaboration, and accelerate innovation in advanced manufacturing.

Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

07/30/2026 | Dymax
Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed circuit boards.
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