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Next Generation Microelectronics: AT&S Honors Top Apprentices

05/04/2026 | AT&S
The Austrian high-tech company AT&S is a global player in the world of microelectronics. Driven in particular by the boom in applications related to artificial intelligence (AI), IC substrates and high-tech printed circuit boards from AT&S are currently in strong demand.

SAIC Wins $75.2M PRISM Task Order for Naval Aviation Systems Support

05/04/2026 | SAIC
Science Applications International Corp. has been awarded a new $75.2 million task order under the General Services Administration (GSA) Personnel and Readiness Infrastructure Support Management (PRISM) contract to provide critical support to the Naval Air Systems Command (NAVAIR).

Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026

05/01/2026 | Indium Corporation
As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/01/2026 | Michelle Te, I-Connect007
If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once. My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging.

Everspin Executes $40M Agreement for Mil-Aero MRAM Applications

05/01/2026 | Everspin Technologies, Inc.
Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
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