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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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A.R.T. Supports IPC/WHMA-A-620 Revision F with Updated Training Materials

06/16/2026 | A.R.T. Ltd.
Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of IPC-certified training and an IPC-authorized distributor, is supporting the transition to IPC/WHMA-A-620 Revision F with updated training materials for cable and wire harness assembly.

Will This PCB Material Still Be Available in 30 Years?

06/16/2026 | Laura Martin, Isola
One of the most common questions I receive from aerospace and defense customers has nothing to do with dielectric constant, dissipation factor, or thermal performance. Instead, the conversation often starts with a simple question: "If we design this material into our platform today, will it still be available in 30 years?"

TM Soldering Solutions Launches EmberX Selective Soldering Control Software

06/15/2026 | TM Soldering Solutions
TM Soldering Solutions introduces its powerful EmberX software control package, developed for its PHOENIX Selective Soldering platforms.

Dry Ice Blasting Offers Alternative Cleaning Method

06/15/2026 | Jonathan Dean, Cold Jet
Cleanliness is a critical factor in the production of every electronic component, from wafer fabrication to final product assembly. Unclean surfaces and parts can ruin entire batches of products, negatively affecting product performance, production yield rates, and overall operational costs. Any lapse in production quality or excessive downtime can be detrimental to an electronics manufacturing facility.

Getters for Hermetic Packages: Mechanisms, Reliability Impact, and MacDermid Alpha Electronics Solutions

06/11/2026 | Michael Previti, MacDermid Alpha Electronics Solutions
Hermetic packages protect chips, lasers, and sensors from the outside world, but the cavity inside can still change after seal. Small amounts of water, hydrogen, carbon dioxide, and organic vapor may remain after build or may form later from adhesives, films, and other internal materials. Getters reduce that risk by creating a planned sink for those gases inside the package. When teams choose the right getter early, they hold the headspace steady, cut reliability escapes, and lower the life-cycle cost of a high-value device.
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