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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

What Climate Week NYC Conversations Mean for the Electronics Industry

10/09/2026 | Kelly Scanlon and Seth Jacobsen, Global Electronics Association
Climate Week NYC brought together plenty of big ideas, but the conversations that stayed with us were grounded in everyday business realities. Companies are thinking about sustainability in terms of what it means for their ability to manage risk, keep costs in check, secure materials and energy, and remain competitive. That is particularly relevant for electronics. Our industry relies on global supply chains, specialized materials, dependable infrastructure, and skilled people. As demand for AI, computing capacity, and new technologies grows, so does the pressure on all those systems.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/09/2026 | Nolan Johnson, I-Connect007
Have you ridden in a robotaxi yet? Increasingly, there are sightings in some of the major cities here in the western U.S, particularly San Francisco. This past week, we published a news item from Berg Research projecting that robotaxis will grow from 6,500 deployments today to more than 1.5 million over the next 10 years. The technology for fully autonomous vehicles continues to look like an emerging tech driver for the EV sector.

Applied Materials, Intel Collaborate on AI Chipmaking Innovations

10/08/2026 | Globe Newswire
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, announced it is working with Intel Corporation to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.

Elephantech to Open Toyosu Advanced Packaging Center

10/08/2026 | Elephantech
Elephantech Inc. announces plans to commence operations at its new Toyosu Advanced Packaging Center (Toyosu APC) in March 2027.

Keysight Advances its Design Software with Agentic AI

10/08/2026 | BUSINESS WIRE
Keysight Technologies, Inc. is bringing agentic AI to its software, enabling engineers to direct AI agents to automate complex design tasks. Customers can use their large language models (LLMs) to generate and optimize designs, with Keysight simulation validating the agents’ progress.
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