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Advanced Electronics Packaging Digest

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Incap Germany’s Karlsfeld Factory Achieves ISO/IEC 27001:2022 Certification

07/07/2026 | Incap
Incap Electronics Germany’s factory in Karlsfeld has achieved ISO/IEC 27001:2022 certification, confirming that its information security management system meets the international standard for protecting sensitive data across their operations.

Global Semiconductor Sales Increase 9.2% On-Month in May

07/07/2026 | SIA
The Semiconductor Industry Association (SIA) announced global semiconductor sales were $120.6 billion during the month of May 2026, an increase of 9.2% compared to the April 2026 total of $110.5 billion and 104.1% more than the May 2025 total of $59.1 billion.

ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging

07/07/2026 | BUSINESS WIRE
Advanced Chip and Circuit Materials (ACCM) introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of thermal expansion of silicon while running on established organic-substrate manufacturing lines.

Koh Young America Promotes Heriberto Cuevas to Country Manager of Mexico and South America Operations

07/07/2026 | Koh Young
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, proudly announces the promotion of Heriberto Cuevas to Country Manager for its Mexico and South America operations.

East West Manufacturing Acquires Vexos

07/06/2026 | BUSINESS WIRE
East West Manufacturing, a leading Integrated Manufacturing Solutions (IMS) company that designs and manufactures complex electronic and electro-mechanical products, announced the acquisition of Vexos, an award winning electronics manufacturing services (EMS) company.
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