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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4

06/04/2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?

DP Patterning Accelerates Toward U.S. Market Expansion

05/28/2026 | PRNewswire
DP Patterning, a Swedish tech company specializing in advanced manufacturing of flexible electronics, has moved into a new production facility in Norrköping, Sweden.

SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics

05/19/2026 | SEMI
FlexTech, a SEMI Technology Coalition, issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.

Eltek Reports 2026 Q1 Financial Results

05/19/2026 | PRNewswire
Eltek Ltd., a leading global manufacturer of high-quality printed circuit boards, announced its financial results for the quarter ended March 31, 2026.

Global PCB Market to Reach $122.8B Amid Growth in Flexible and HDI Boards

05/19/2026 | Globe Newswire
The global printed circuit board market size is estimated to grow from USD 70.44 billion in the current year to USD 122.8 billion by 2035, achieving a CAGR of 5.18% during the forecast period.
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