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Take the Mic: Advanced Encapsulation Process with LPMS USA
March 27, 2026 | Real Time with... APEX EXPOEstimated reading time: Less than a minute
Explore LPMS USA's innovative low pressure molding process for LED circuits, demonstrated by Brian Betti at APEX EXPO 2026. Witness the KAPPA 1100H machine utilizing a low-viscosity polyamide resin to safely encapsulate sensitive components. This professional demonstration highlights advanced manufacturing techniques and the versatility of low-pressure molding for electronic applications.
APEX EXPO 2026 has concluded successfully. If you couldn’t make it to the show, don’t worry, the I-Connect007 team has coverage of the entire week’s events. Watch your inbox on Fridays over the next several weeks for our complete coverage, delivered directly to your inbox, or visit Real Time with… APEX EXPO 2026 now for video interviews with the movers and shakers of the electronics industry.
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