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Datest Invites Engineers to Stop Fighting AXI False Calls

03/25/2026 | Datest
On Tuesday, April 14 at 10:00 AM PT, Datest will host a technical webinar presented by Jesper Lykke, chief executive officer of Viscom, exploring how modern AXI systems are finally getting smarter about what they flag, and what they don’t.

TRI Highlights Advanced SEMI Inspection and Metrology Solutions at SEMICON SEA 2026

03/25/2026 | TRI
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at MITEC, Kuala Lumpur, Malaysia from May 5 - 7, 2026.Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at MITEC, Kuala Lumpur, Malaysia from May 5 - 7, 2026.

Elementary, Mr. Watson: Navigating the Dreaded DFX Triangle

03/26/2026 | John Watson -- Column: Elementary, Mr. Watson
After being in both industry and academia for more years than I’d like to say (before tape and Mylar, it felt like rock slabs and chisels), I’ve noticed a belief that PCB design is a linear process. Even experienced PCB designers assume you just begin with requirements, move to schematic capture and layout, and create the documentation package. Now their job is done, right? They throw it over the fence, and “magically” the finished PCB ends up on their desks a few weeks later.

Unitemp Launches ESPEC Deep Capacity HAST Chamber in UK for Large PCB Testing

03/24/2026 | Unitemp
A new deep‑capacity Highly Accelerated Stress Test (HAST) chamber capable of accommodating large multilayer PCBs and high specimen volumes is now available in the UK, as Unitemp introduces ESPEC’s latest model, the EHS‑222M‑L.

Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics

03/18/2026 | I-Connect007
I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.
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