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New, Greener Solutions for Etch: Novel Copper Extraction
March 30, 2026 | Richard Nichols, GreenSource EngineeringEstimated reading time: 1 minute
“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.
Dissolved copper concentration is a key parameter for high-resolution circuit formation in cupric chloride etch solutions. Too little dissolved copper will exacerbate isotropic etching and result in poor line shape, while too much copper will render the etch rate too low to be a viable process. This leads to solution sludging and the inevitable formation of crystals on rollers, which can be detrimental to high-end, tight-feature yields. Controlling the copper concentration is essential for a stable operation.
This article presents an overview of an ion exchange process that has been fully developed through testing and will soon be made available to the PCB industry as a method for copper control in cupric chloride etching. Testing has established that a copper-phillic medium is a viable alternative to the predominant solvent extraction method used for copper control in cupric etch solutions, also known as liquid-liquid extraction (LLE) systems. Though well-maintained LLE systems are effective, the risks of using a highly flammable solvent in a PCB environment are obvious. Cost, footprint, potential cross-contamination of the etching process, and end-of-life care considerations are significant motivations for doing this differently.
To continue reading this article, which originally appeared in the March 2026 edition of I-Connect007 Magazine, click here.
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Nortech Systems Launches Power over Fiber Technology Platform for EMI-Sensitive Applications
04/08/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, has announced the launch of its Power over Fiber technology platform.
Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
04/09/2026 | Joe Fjelstad -- Column: Flexible ThinkingFlex circuits flex. No surprises there. However, they are also very commonly designed into products because they are thin and offer consistent thickness and dielectric properties, attributes highly prized by present-day product designers of personal electronics. This would include smartphones and, increasingly, wearable electronics for medical monitoring and even fashion.
Understanding Tolerances in Flexible Circuit Design
04/01/2026 | Chris Clark, Flexible Circuit TechnologiesThe challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.
Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
Indium Presents Cost-Effective Copper Sinter Solutions for Power Electronics at APEC 2026
03/19/2026 | Indium CorporationIndium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance, while addressing power electronics cost pressures at APEC 2026, March 22-26, in San Antonio, Texas.