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Suggested Items

From Panels to Post-its

04/07/2026 | Lorena Villanueva, Global Electronics Association Mexico
Last January, I attended the Global Leadership Summit of the Wire Harness Manufacturer’s Association (WHMA) in Las Vegas, and there was a subtle shift in one of the events that everyone could feel. We still had the traditional conference rhythm: strong keynote, well-prepared panels, and smart people in the room. There were also, sometimes, some careful answers—useful, but not always candid. So, I was curious when WHMA introduced a new peer-to-peer format for one session.

An Update on the Omnibus on Sustainability Reporting

04/01/2026 | Diana Radovan, Global Electronics Association
The European Commission (EC) released its Omnibus on Sustainability Reporting Proposal on Feb. 26,  2025, as part of its agenda to simplify EU sustainability legislation and reduce administrative burdens for companies while safeguarding the objectives of the EU Green Deal, including content and a timeline proposal. The initial “content” proposal amended key content-related provisions of the Corporate Sustainability Reporting Directive (CSRD), the Corporate Sustainability Due Diligence Directive (CSDDD), and the EU Taxonomy (EUT) Regulation.

Educational Highlights From the APEX EXPO 2026 Show Floor

03/27/2026 | Kimberly Kutnick, Global Electronics Association
APEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.

The Chemical Connection: Managing Cumulative Process Variations for Fun and Profit

03/23/2026 | Don Ball -- Column: The Chemical Connection
Tolerances have become increasingly tight as PCBs have grown more complex and reduced in size, weight, and power consumption. Even if we maintain a traditional ±10% variation in etched line width, the tolerance in a 50 µm (0.002" or 2 mils) wide etched line is only 5 µm (0.0002” or 0.2 mils). That’s not very much, and it gets even worse as the line and space requirements drop to 25 µm lines and spaces.

Jeonbuk Researchers Advance Segregated Composite Fabrication and Modeling

03/18/2026 | PRNewswire
Modern portable and wearable electronic devices increasingly integrate high-performance components and wireless communication technologies. While this integration enhances functionality, it also raises the risk of electromagnetic interference (EMI) and heat accumulation, both of which can degrade device performance and reliability.
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