I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series

Estimated reading time: 1 minute

I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and Future of Electronics. Titled “Reliability Under Pressure—PCBs in Harsh Environments,” this episode explores the challenges of maintaining long-term performance in demanding applications like aerospace, automotive, and defense.

Host Marcy LaRont speaks with Laura Martin, director of strategic markets at Isola, about what reliability truly means when printed circuit boards are pushed to their limits.

Martin explains that reliability is no longer defined by temperature thresholds or traditional metrics like Tg alone. Instead, engineers must evaluate how cyclic strain affects composite materials over time. The discussion highlights key factors, including thermal cycling, Z-axis expansion, moisture under bias, and anisotropic behavior, each contributing to fatigue and eventual failure.

The episode also examines common failure mechanisms, including plated through-hole cracking and interfacial delamination, underscoring the need for a more nuanced approach to material selection, one centered on strain management and real-world conditions.

“As electronics move into increasingly harsh environments, understanding how materials behave under stress is essential,” said LaRont. “This episode offers valuable insight into designing for durability, not just compliance.”

Listeners will gain a deeper understanding of how to:

• Evaluate materials beyond traditional specifications
• Anticipate and mitigate long-term reliability risks
• Design PCBs that withstand real-world environmental stressors

All episdoes of the PCB Materials: The Backbone and Future of Electronics podcast series can be heard on Apple, Spotify or at I-Connect007.