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TLT Electronics Officially Opens Facility in Vietnam

05/06/2026 | TLT Electronics
Lithuanian EMS provider TLT Electronics has recently announced the opening of a new facility in Vietnam. For their clients, this is a chance to expand manufacturing into a second region without the headache of onboarding a new supplier. Same team, same processes, same quality standards — still TLT Manufacturing, just on another continent.

Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional

05/06/2026 | Michael Carano -- Column: Trouble in Your Tank
There is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.

Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect

05/05/2026 | Michelle Te, I-Connect007
Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.

The Missing Connection: Wire Harness Quoting Joins the Digital Age

05/01/2026 | Joanne Harris, Tech-2marketing
Walk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.

EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space

04/28/2026 | ECIO
Every chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
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