Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Edge AI Semiconductor Market Size to Hit $151.30 Billion by 2035

07/10/2026 | Globe Newswire
The global Edge AI Semiconductor Market Size was valued at $25.36 Billion in 2025 and is projected to reach $151.30 Billion by 2035, growing at a CAGR of 19.57% during 2026–2035.

Micron Announces Up to $3 Billion Strategic Investment to Strengthen U.S. Semiconductor Ecosystem

07/10/2026 | Micron
Micron Technology, Inc.  announced plans to invest up to $3 billion to strengthen the U.S. semiconductor supply-chain ecosystem and enable the critical semiconductor manufacturing footprint needed for future technology innovation.

SEALSQ, GlobalFoundries Partner to Accelerate Post-Quantum Cryptography and Quantum Computing Technologies

07/10/2026 | Globe Newswire
SEALSQ Corp and GlobalFoundries announced a strategic Memorandum of Understanding (MoU) to co-develop across secure semiconductor platforms, Post-Quantum Cryptography (PQC) and emerging semiconductor-based quantum computing technologies.

SEMI, TechSearch International Release 2026 Edition of Worldwide Assembly & Test Facility Database

07/08/2026 | SEMI
SEMI and TechSearch International announced the release of the 2026 edition of the Worldwide Assembly & Test Facility Database, a comprehensive resource tracking semiconductor back-end manufacturing facilities operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) companies worldwide.

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in