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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Limited Capacity, Order Shifts Drive March Consumer DRAM Price Surge, Led by Sub-4Gb Products
April 7, 2026 | TrendForceEstimated reading time: 1 minute
Major suppliers are continuing to phase out production of mature products below DDR4, according to TrendForce’s latest research on the memory industry. As supply tightens structurally, DRAM prices have already posted significant cumulative increases in recent months.
TrendForce forecasts that consumer DRAM contract prices will continue to rise by 45–50% QoQ in 2Q26 after taking into account ongoing supply reductions, order transfers, and the slower pace of capacity expansion among Taiwanese suppliers.
TrendForce reports that in March 2026, the pricing trends in the consumer DRAM sector were mainly driven by products with densities under 4 Gb. For instance, the average prices for DDR4 4 Gb increased by over 20% MoM, far outpacing price increases seen in higher-density products. This followed an earlier price jump in DDR4 and a 2025 announcement from major suppliers that some legacy-node products would be reaching end-of-life (EOL).
Taiwanese manufacturers shifted capacity toward DDR4 to capture the first wave of spillover demand. However, demand is now also shifting into DDR3 and DDR2 markets. With capacity constraints limiting supply, average prices across DDR3 and DDR2 products increased by 20–40% in March, marking an even sharper rise.
Looking ahead to the second quarter, Taiwanese suppliers raised quotations in March, with some prices already reflecting expected second-quarter increases. Furthermore, they’ve adopted a more assertive pricing stance amid constrained capacity and intensifying order migration.
Consequently, transaction price gaps across different customers are expected to narrow significantly in the coming quarter. In contrast, South Korean suppliers already command relatively higher ASPs in the consumer DRAM segment, and are therefore expected to implement more moderate price adjustments in the near term.
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Global Sourcing Spotlight: The True Cost of Low Cost
03/25/2026 | Bob Duke -- Column: Global Sourcing SpotlightThere’s an illusion in global sourcing that cheaper means better business. For decades, procurement teams received rewards for driving down unit prices, without realizing how many zeros those “savings” add to the other side of the ledger. With today’s volatile, interconnected supply chains, the lowest price is rarely the lowest cost.
The Right Approach: Reflections on 50 Years in the Business, Part 2
03/11/2026 | Steve Williams -- Column: The Right ApproachIn 1998, I had just reunited with my high school sweetheart (now my wife) when my Dad, the vice president of Plexus, told me they were looking for a PCB commodity manager with subject matter expertise. I interviewed for the position and became the global PCB commodity manager for Plexus, which had been my largest customer. They would not have offered me the position without my undergraduate degree.
American Standard Circuits to Exhibit at the Seattle BCI Defense and Aerospace Summit 2026
03/10/2026 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits and ASC Sunstone, has announced that his company will be attending the Seattle BCI Defense and Aerospace Summit to be held March 18-19, 2026, at the Washington State Convention Center in Seattle, Washington.
Insulectro Technology Village to Feature 30 Powerchats at APEX EXPO in Booth 4237
03/04/2026 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, will present its popular and successful 13.5-minute PowerChats™ during this year’s IPC APEX EXPO at the Anaheim Convention Center, March 17-19, 2026.
Announcing the New, Integrated I-Connect007 Magazine
01/20/2026 | I-Connect007 Editorial TeamDesign and fabrication have always been closely connected, but the rising demands for reliability, performance, and cost efficiency now require a closer alignment than ever before. Today we are debuting I-Connect007 Magazine, which brings our Design007 Magazine and PCB007 Magazine under a single title. This evolution enables us to present a more comprehensive view of the PCB and interconnect lifecycle while maintaining the depth, technical rigor, and practical focus that you expect. Look inside!