Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

MacDermid Alpha to Debut Zero-PFAS Die Attach Paste ATROX CD 560-1 at SEMICON Southeast Asia 2026

04/27/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will debut ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, May 5–7, in Kuala Lumpur, Booth 2423.

Fineline Global to Exhibit at PCB East 2026, Showcasing Global PCB Solutions for North American Market

04/23/2026 | Fineline Global
Fineline Global, a leading global provider of advanced printed circuit board (PCB) solutions, today announced that it will be exhibiting at PCB East 2026 on Wednesday, April 29 at the DCU Convention Center in Worcester, Massachusetts.

Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream

04/23/2026 | Team NCAB -- Column: Fresh PCB Concepts
When engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not. 

Powering the Future: Why Thermal Management Defines the Future of Electronics

04/15/2026 | Brian Buyea -- Column: Powering the Future
Every leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.

John Andresakis Discusses Integrated Thin-film Resistive Foil Technology

04/10/2026 | Real Time with... APEX EXPO
John Andresakis of Ohmega Ticer shares his advanced solution that offers miniaturization, enhanced electrical performance, and stable resistance for next-generation PCBs. The high-demand applications for high-frequency phased-array antennas in commercial space and military sectors is driving the need for superior RF performance and simplified beam forming.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in