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Suggested Items

New SMT007 Magazine: Wire Harness Solutions

04/01/2026 | I-Connect007 Editorial Team
In the new issue of SMT007 Magazine, explore what’s shaping wire harness manufacturing and how new solutions are helping companies streamline operations and better support EMS providers. Hear from experts at the Wire Harness Manufacturer’s Association, companies advancing automated quoting, and see how these shifts are influencing production in one of the world’s largest wire harness hubs: Mexico.

Learning with Leo: Why Risk-based Auditing Is Reshaping Cable Assembly Quality

04/01/2026 | Leo Lambert -- Column: Learning With Leo
Effective product development requires early and active participation from all stakeholders. The design process must include input from supply chain, manufacturing engineering, purchasing, quality, and production. A design cannot be considered complete until it has been evaluated against the full manufacturing process, whether executed by an OEM or a subcontractor. Without this collaboration, designs are often released that are not manufacturable in real-world conditions.

Is AI in Design the Magic Tonic for All That Ails Us?

03/20/2026 | David Wiens, Siemens
In electronic systems design, engineering teams are pressured by management to adopt AI wherever possible to reduce design cycle time and cost. Engineers look at AI with a wary eye: Will it consistently return accurate results? Will it take longer to set up, train, run, and verify than doing it manually? Will it replace me? Yes, there is a transition with AI, but it’s no different than any other form of automation. It must be extensively

From PEDC to APEX: Banyan.eco’s Disruptive AI for EMS and OEM Companies

03/17/2026 | Marcy LaRont, I-Connect007
The electronics industry’s struggle with supply chain resilience and increasing regulatory complexity has created a costly compliance challenge for OEMs and EMS providers alike. At the same time, advances in artificial intelligence are opening new possibilities for automating some of the industry’s most data-intensive tasks. At the Pan-European Design Conference (PEDC), Banyan.eco cofounder Francis D’Souza introduced a new approach that combines AI-driven data acquisition with a deterministic verification layer to eliminate compliance risk from AI hallucination and dramatically improve productivity.

Webinar Review, Part 1: A Packaging Revolution Powering the Next Era of AI Compute

03/15/2026 | Marcy LaRont, I-Connect007
The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.
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