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Advanced Electronics Packaging Digest

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Dow Launches DOWSIL TC-3120 Thermal Gel for Optimum Heat Transfer for Optical Modules, Dense Electronics and High-speed Data Applications

06/01/2026 | Dow
Dow has announced the launch of DOWSIL™ TC-3120 Thermal Gel, a silicone-based material designed to optimize heat transfers and provide optical-grade cleanliness. It has the highest thermal conductivity (~12 W/m·K) among Dow’s commercially available silicone gels and is designed to minimize oil bleeding and condensed outgassing – contaminants that can reduce the reliability of optics and electronics.

Micro LED CPO Optical Transceiver Market to Reach $848M by 2030

05/11/2026 | TrendForce
TrendForce’s latest research into the Micro LED industry highlights how generative AI is driving rapid growth in demand for high-speed optical communications.

Molex Completes Acquisition of Teramount Ltd.

05/07/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

NVIDIA, Corning Partner to Boost U.S. AI Manufacturing

05/06/2026 | BUSINESS WIRE
NVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.

AI Interconnect Boom Drives Southeast Asia Outsourcing Expansion

05/05/2026 | TrendForce
Global shipment volume of optical transceivers is projected to more than triple from 26.5 million units in 2023 to over 92 million units by 2026, according to TrendForce’s latest AI infrastructure research.
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