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FlashPCB Welcomes Adam Broeckert, EIT as Manufacturing Engineer
April 20, 2026 | FlashPCBEstimated reading time: 1 minute
FlashPCB, a leading provider of quick-turn PCB assembly, is pleased to announce the addition of Adam Broeckert, EIT, as Manufacturing Engineer.
In this role, Broeckert will support FlashPCB’s production operations, working closely with engineering and manufacturing teams to optimize processes, improve efficiency, and ensure high-quality output for customers requiring fast, reliable PCB assembly. He will play a key role in supporting design for manufacturability (DFM), troubleshooting production challenges, and helping scale operations as demand continues to grow.
Broeckert brings a strong background in systems and vehicle engineering from his previous role at Booz Allen Hamilton, where he supported the United States Postal Service’s Next Generation Delivery Vehicle (NGDV) program. His experience includes coordinating and executing test programs, contributing to engineering design solutions, and working directly with manufacturing teams to evaluate progress and performance.
He holds a Bachelor of Science in Mechanical Engineering from The University of Alabama, where he graduated summa cum laude, and is certified as an Engineer in Training (EIT).
FlashPCB specializes in quick-turn PCB assembly, offering a streamlined process that includes automated design rule checks, rapid bill of materials generation, and fast quoting to help customers move from design to production with speed and confidence.
“Adam brings a strong mix of engineering fundamentals and real-world program experience,” said Thomas Castner, CEO, FlashPCB. “His ability to work across design, testing, and manufacturing will be a valuable asset as we continue to grow and support our customers’ timelines.”
Based in Philadelphia, FlashPCB supports a wide range of industries with fast, dependable PCB assembly solutions designed to meet tight deadlines without compromising quality.
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04/20/2026 | PRNewswireIBM and the Grainger College of Engineering at the University of Illinois Urbana-Champaign (U. of I.) announced an expansion of the IBM-Illinois Discovery Accelerator Institute.
CACI Delivers Mission-Ready Tactical Satellite Communications to Special Operations Forces
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Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
04/15/2026 | Anaya Vardya -- Column: Standard of ExcellenceWhen it comes to complex, high-performance electronics, the line between sales and engineering has all but disappeared. Customers want more than a quote. They’re not simply buying boards; they’re buying understanding, so engineering is now the front line of customer trust, problem-solving, and long-term success. There was a time when sales meant persuasion, and engineering meant production. Today, the two are inseparable.
The Next Generation of Leadership: New Student Board Member Aubrey Smith
04/10/2026 | Marcy LaRont, I-Connect007At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.
Elsyca Acquires Hivelix to Strengthen Simulation Platform for Electrochemical Surface Engineering
04/03/2026 | ElsycaElsyca, a global pioneer in computer-aided engineering (CAE) simulation for electrochemical processes and surface finishing, announces the acquisition of Hivelix, a specialist in advanced surface treatment simulation with strong expertise in multiphysics modelling and AI-assisted process optimisation.