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Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles. Chiplet technology is recognized as a critical solution to address rising costs and bottlenecks amidst rapidly increasing computing requirements for modern, software-defined vehicles. Silicon Box will support the ACP's research initiative with its end-to-end know-how in chiplet interconnection, from consulting on optimal chiplet architecture for sustainable and scalable technology roadmaps, to turnkey solutions for advanced packaging and testing.
Accelerating Automotive (Chip) Innovation
Through imec's Automotive Chiplet Program, Silicon Box will draw on its proprietary advanced packaging capabilities and capacity, and collaborate with other consortium members to accelerate chiplet solutions for modern vehicles. Tangible outcomes include:
- Automotive Chiplet Interoperability: Help review system architectures and define interconnection protocols that meet stringent safety, reliability, performance and thermal requirements
- Advanced Packaging R&D - De-risked Packaging: Support package development and material reviews to ensure chiplet connections meet automotive quality targets
"The ACP is a huge step forward for the rapidly growing chiplet ecosystem, because it means that the automotive industry - a key pillar of European industrial strength - has recognized the benefits of chiplet technology and is making a commitment to accelerate development and adoption at scale," said Dr. BJ Han, co-founder and CEO of Silicon Box. "Chiplet technology is gaining traction within the automotive chip industry for its potential to shorten time-to-market, ensure stable supply and reduce development costs."
"Advanced packaging technology can enable seamless, flexible interconnections between chiplets for version upgrades and to support the high-density interconnections required by advanced automotive systems that demand significantly higher compute than traditional single chip-systems," said Mike Han, chief revenue officer at Silicon Box. "Being part of this consortium aligns with our ongoing mission to revolutionize the semiconductor industry through chiplet enablement, and support the cutting-edge ambitions of our automotive customers."
Silicon Box Automotive Roadmap
At the sixth ACP Forum last November, Dr. BJ Han delivered a keynote on advanced packaging for automotive applications and how chiplet architecture specifically meets high compute needs of autonomous driving. The company's participation in imec's ACP will enhance alignment of its technology roadmap with emerging industry standards.
Silicon Box is already co-developing chiplet-based automotive-grade packages with customers for next-generation advanced driver assistance systems (ADAS). Last month, Silicon Box received an IATF 16949 Letter of Conformance (LoC) to support automotive-grade packaging solutions and is expected to achieve full certification in the coming months. Revenue from automotive customers grew at an annualized rate of 436% in the first quarter of 2026, highlighting the importance of the automotive sector to the company's burgeoning business.
In October last year, Silicon Box announced it hit a 100-million-unit production milestone at it's Singapore flagship foundry, while demonstrating industry-leading yield—proving that advanced panel-level packaging is ready to enable the chiplet era, and rapidly scale for the digital age. The company is planning its second facility in Novara, Italy, supporting the EU's strategic goal to produce 20% of the world's semiconductors by 2030 with first-of-a-kind technology. With production start targeting 2028, the Novara site will fully replicate Silicon Box's panel-level packaging capacity and deliver a native test ecosystem, establishing the full semiconductor value chain from design through to final manufacturing and test in Europe. Including the automotive industry, the facility will serve customers across sectors such as artificial intelligence (AI), high-performance computing (HPC), mobile, Internet of Things (IoT), robotics and space tech. The project recently reached a critical milestone through the signing of a Development Agreement with the Italian Ministry of Enterprises and Made in Italy.
