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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Fineline Global to Exhibit at PCB East 2026, Showcasing Global PCB Solutions for North American Market
April 23, 2026 | Fineline GlobalEstimated reading time: 1 minute
Fineline Global, a leading global provider of advanced printed circuit board (PCB) solutions, today announced that it will be exhibiting at PCB East 2026 on Wednesday, April 29 at the DCU Convention Center in Worcester, Massachusetts. Visitors can meet the Fineline team at Booth 410 to learn more about the company’s comprehensive, technology-driven PCB offerings and its expanding presence in the North American market.
Fineline Global continues to build momentum across North America by delivering high-reliability PCB solutions backed by global manufacturing strength, advanced engineering support, and a customer-first approach. The company specializes in complex, high-tech applications including HDI, RF, rigid-flex, and advanced substrate technologies, serving industries such as aerospace, defense, medical, and industrial electronics.
“PCB East is an important opportunity for us to connect directly with engineers, designers, and decision-makers who are looking for more than just a supplier—they’re looking for a true global partner,” said Clive Wall, North American Director of Business Development at Fineline Global. “Our focus is simple: bring world-class PCB technology, backed by strong engineering and supply chain expertise, to customers who need performance, reliability, and responsiveness. We’re here to show that Fineline is ready to lead in North America.”
At Booth 410, attendees will have the opportunity to explore how Fineline’s integrated approach—from design support through production—helps reduce risk, improve performance, and accelerate time to market.
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Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
PCB Technologies to Exhibit at PCB East 2026
04/23/2026 | PCB Technologies Ltd.Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
GreenSource Fabrication to Exhibit at PCB East 2026
04/23/2026 | GreenSource FabricationGreenSource Fabrication, the N. American industry’s most advanced, state-of-the-art printed circuit board manufacturer, today announced that it will be exhibiting at PCB East 2026, on Wednesday April 29,2026 at the DCU Convention Center 50 Foster Street in Worcester, MA.
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.